发明名称 PROCESS AND COMPOSITION FOR BONDING SUBSTRATES
摘要 Combination prod. (I) for bonding synthetic plastic jointing parts contains a cyano-acrylate adhesive (II) and imidazole deriv(s). of formula (III) as primer. In (III), R1 = opt. Ph-substd. 1-4C alkyl; R2 = H or 1-4C alkyl. Also claimed is the primer, dissolved in polar organic solvent which evaporates at room temp. Pref., R1 = Me or benzyl, and R2 = H or Me. Solvents are 3-8C ketones, 1-4C alkanols or (1-4C alkyl) acetates, and the soln. contains 0.001-5 (pref. 0.05-2) wt.% (III). (II) are known cyanoacrylate adhesives. Pref. solvent is, e.g. acetone, MEK, MeOH, EtOH, PrOH, BuOH, EtOAc, PrOAc or BuOAc. USE/ADVANTAGE - (III) are useful as primers for bonding jointing parts of polyolefin (e.g. PE or PP), fluoro polymer or thermoplastic rubber, including silicone rubber (claimed); also claimed is the bonding process as such, in which first (III) and then (II) is applied to the surfaces to be joined. Use of (III) as primer gives very strong bonds with (II); the bond strength increases the longer the primer is left in contact with the substrate before (II) is applied (contrast prior-art primers) and only decreases again after several hrs. contact time. (6pp Dwg.No.0/0)
申请公布号 ZA9104169(B) 申请公布日期 1992.02.26
申请号 ZA19910004169 申请日期 1991.05.30
申请人 HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN 发明人 HEINZ NICOLAISEN;ANNETTE REHLING
分类号 C09J4/00;C09J4/04 主分类号 C09J4/00
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