| 摘要 |
PROBLEM TO BE SOLVED: To ensure electric wiring that eliminates the need for considering voltage polarity, and to provides an airtight structure that prevents leakage in terms of airtight device and manufacturing method. SOLUTION: A device 1 is fabricated by mounting an electronic element 4 in an airtight structure with an pressurized space 5 formed using a silicon substrate 2 and glass structure 3. The silicon substrate 2 is equipped with a first insulated film 21 formed on the surface, a conductive film 22 patternized in a predetermined shape on the upper side of the first insulated film 21, a second insulated film 23 formed on the upper side of the conductive film 22, and a poly-silicon film 24 formed on the upper side of the second insulated film 23 and then ground flat in such a way that no step is produced on the surface. The glass structure 3 is joined to the poly-silicon film 24 ground flat over the silicon substrate 2 so as to form an airtight structure. The conductive film 22 electrically connects the inside and outside of the airtight structure through the lower side of the junction 30 of the glass structure 3 and poly-silicon film 24. COPYRIGHT: (C)2006,JPO&NCIPI
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