发明名称 Silicon carbide substrate, semiconductor device, and methods for manufacturing them
摘要 A silicon carbide substrate has a first main surface, and a second main surface opposite to the first main surface. A region including at least one main surface of the first and second main surfaces is made of single-crystal silicon carbide. In the one main surface, sulfur atoms are present at not less than 60×1010 atoms/cm2 and not more than 2000×1010 atoms/cm2, and carbon atoms as an impurity are present at not less than 3 at % and not more than 25 at %. Thereby, a silicon carbide substrate having a stable surface, a semiconductor device using the substrate, and methods for manufacturing them can be provided.
申请公布号 US9437690(B2) 申请公布日期 2016.09.06
申请号 US201514870777 申请日期 2015.09.30
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 Ishibashi Keiji
分类号 H01L29/32;H01L21/02;C30B29/36;C30B31/04;H01L29/16;H01L29/66;H01L29/812;H01L29/04;H01L29/36 主分类号 H01L29/32
代理机构 Drinker Biddle & Reath LLP 代理人 Drinker Biddle & Reath LLP
主权项 1. A silicon carbide substrate, comprising: a first main surface; and a second main surface opposite to said first main surface, a region including at least one main surface of said first and second main surfaces consisting essentially of single-crystal silicon carbide, sulfur atoms being present in said one main surface at not less than 80×1010 atoms/cm2 and not more than 800×1010 atoms/cm2, and carbon atoms as an impurity being present in said one main surface at not less than 3 atomic percent (at %) and not more than 25 atomic percent (at %).
地址 Osaka-shi, Osaka JP