METHOD FOR MACHINING A LEAD FRAME, AND LEAD FRAME

摘要

The invention relates to a method for machining a lead frame which has at least one electrically conductive contact portion, having the following steps: - forming a depression in the at least one electrically conductive contact portion such that a first electrically conductive sub-contact portion and a second electrically conductive sub-contact portion are formed, said sub-contact portions being delimited from each other by means of the depression, and - forming a housing, which has a housing frame (1003) that is at least partly embedded into the lead frame, from a housing material, The formation of the housing includes the introduction of housing material (1605) into the depression such that a housing frame portion made of the housing material introduced into the depression is formed between the first and the second electrically conductive sub-contact portion in order to mechanically stabilize the first and the second electrically conductive sub-contact portion by means of the housing frame portion. The invention further relates to a lead frame and to an optoelectronic lighting device.