| 摘要 |
<p>A semiconductor device manufacturing apparatus is provided to check the width of a rinsed wafer edge region in real time by using a monitoring unit composed of a photographing part and an image display part. The semiconductor device manufacturing apparatus includes a wafer spin chuck(13) for loading stably a wafer, a photoresist spraying unit arranged at an upper portion of the wafer spin chuck, a rinse unit for rinsing a photoresist layer of the wafer at one side of the wafer spin chuck, and a monitoring unit for monitoring a wafer edge region. The monitoring unit is composed of a photographing part(50) for photographing the wafer edge region and an image display part(55) for displaying the photographed wafer edge region.</p> |
