3D ELECTRONIC CIRCUIT DEVICE

摘要

Provided is a 3D electronic circuit capable of realizing high-density/sophisticated function mounting, easily inspecting and repairing respective constituent elements, and improving the electronic connection characteristic. The 3D electronic circuit includes a first circuit substrate (101) and a second circuit substrate (102) which are arranged in parallel and in such a way that their substrate surfaces oppose to each other. A peripheral portion of the first circuit substrate (101) and a peripheral portion of the second circuit substrate (102) are connected to each other by connection members (10a to 10d) having a wiring material (103) and a thermal hardening anisotropic conductive sheet (107), thereby performing electric connection.