发明名称 METHOD OF MANUFACTURING MULTILAYER CHIP INDUCTOR
摘要 PROBLEM TO BE SOLVED: To provide the method of manufacturing a multilayer chip inductor capable of certainly preventing the stretch of plating. SOLUTION: The method of manufacturing a multilayer chip inductor comprises the steps of forming a laminate 7 by laminating first-fourth conductor patterns 2-5 and first-fifth magnetic layers 1a-1e, forming a burned object 7a by burning the laminate 7, polishing the burned object 7a, and forming first-fourth outer electrodes 8a-8d on the burned object 7a after the polishing, and reburning, after the burned object 7a is polished, the burned object 7a. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008227046(A) 申请公布日期 2008.09.25
申请号 JP20070061482 申请日期 2007.03.12
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 YAMADA HIROYUKI;TANAKA HIDEKI
分类号 H01F41/04;H01F17/00 主分类号 H01F41/04
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