Electronic component and manufacturing method thereof

摘要

A magnetic substrate has such a shape that ridges extending between principal surfaces are cut away by cutout portions. A multilayer body has corners arranged so as to overlap the cutout portions. A coil includes lead portions which are connected with both ends of a coil portion and which are drawn out to the corners. A coil is combined with the coil to constitute a common mode choke coil and includes lead portions which are connected with both ends of a coil portion and which are drawn out to the corners. Connecting portions connect external electrodes to the lead portions and are provided at the cutout portion.

主权项

1. An electronic component comprising:
a first magnetic substrate having a shape of a substantially rectangular parallelepiped which has mutually opposing first and second principal surfaces, the first magnetic substrate having such a shape that a first ridge extending between the first principal surface and the second principal surface is cut away by a first cutout portion, a multilayer body including a plurality of insulator layers stacked on the first principal surface, the multilayer body having a substantially rectangular shape which has a first corner that is arranged so as to overlap the first cutout portion when viewed in plan from a stacking direction in which the plurality of insulator layers are stacked; a first coil provided in the multilayer body, the first coil including a first coil portion and a first lead portion which is connected with one end of the first coil portion and which is drawn out to the first corner; a second coil provided in the multilayer body, the second coil being combined with the first coil to constitute a common mode choke coil, and including a second coil portion magnetically coupled with the first coil portion; a first external electrode provided on the second principal surface; and a first connecting portion configured to connect the first external electrode to the first lead portion, the first connecting portion being provided at the first cutout portion; wherein when viewed in plan from the stacking direction, the area of the first cutout portion decreases as the area approaches from the second principal surface to the first principal surface.