| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing device and a polishing method capable of improving throughput. <P>SOLUTION: This polishing device has polishing units 30A to 30D having a polishing table having a polishing surface and a top ring for pressing a wafer to the polishing surface of the polishing table. The respective polishing units 30A to 30D are provided with a motor for moving the top ring of the polishing units between a polishing position on the polishing surface and a delivery position of the wafer, and is provided with a polishing part linear transporter 5 for carrying the wafer between a plurality of carrying positions including a delivery position of the water. Pushers 31 to 34 for delivering the wafer between the polishing part linear transporter 5 and the top ring, are arranged in a carrying position of the polishing part linear transporter 5 as the delivery position of the wafer. <P>COPYRIGHT: (C)2008,JPO&INPIT |
