| 摘要 |
A patterning method comprising a first step for forming a conductive film (D) by coating a first plate (10) with a liquid composition and for heating the first plate (10); a second step for forming a conductive pattern (D') on the first plate (10) by pressing a second plate (20) having an irregular pattern shape on the surface against the surface of the first plate (10) whereupon the conductive film (D) is formed and by transferring the unnecessary pattern of the conductive film (D) to the top surface of the protrusions (20a) of the second plate (20) to remove the unnecessary pattern; and a third step for transferring the conductive pattern (D') to the surface of a substrate (30) whereupon the pattern is to be transferred, by pressing the surface of the first plate (10), on which the conductive pattern (D') is formed, against the surface of the substrate (30). The liquid composition contains a solvent exhibiting vapor pressure of 133 Pa or below at the surface temperature of the heated first plate (10). A method for fabricating an electronic element is also provided. A minute and precise pattern is stably formed with good reproducibility by stabilizing the state of the liquid composition coating.
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