| 发明名称 |
CUTTING APPARATUS AND CUTTING METHOD |
| 摘要 |
A cutting apparatus for cutting a workpiece includes: a holding unit for holding the workpiece; a cutting unit including a cutting blade for cutting the workpiece held by the holding unit, and a spindle for rotating the cutting blade; a cutting water supplying unit for supplying cutting water to the cutting blade; and a cleaning fluid jetting unit for jetting to the cutting blade a cleaning fluid for removal of matter adhered to the cutting blade. |
| 申请公布号 |
US2016311127(A1) |
申请公布日期 |
2016.10.27 |
| 申请号 |
US201514695704 |
申请日期 |
2015.04.24 |
| 申请人 |
DISCO CORPORATION |
发明人 |
Itatani Yuya;Ishiai Yoshiki |
| 分类号 |
B26D7/08;H01L21/67;B28D5/02;H01L21/78;B26D7/01;B26D7/18 |
主分类号 |
B26D7/08 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A cutting apparatus for cutting a workpiece, comprising:
holding means for holding the workpiece; cutting means including a cutting blade adapted to cut the workpiece held by the holding means, and a spindle adapted to rotate the cutting blade; cutting water supplying means for supplying cutting water to the cutting blade; and cleaning fluid jetting means for jetting to the cutting blade a cleaning fluid for removal of matter adhered to the cutting blade. |
| 地址 |
Tokyo JP |
