发明名称 Process for making contact with and housing integrated circuits
摘要 The invention proposes a process for producing electrical contact connections for at least one component which is integrated in a substrate material, the substrate material having a first surface region, and at least one terminal contact being arranged at least partially in the first surface region for each component, which is distinguished in particular by application of a covering to the first surface region and production of at least one contact passage which, in the substrate material, runs transversely with respect to the first surface region, in which process, in order to form at least one contact location in a second surface region which is to be provided, at least one electrical contact connection from the contact location to at least one of the terminal contacts is produced via the respective contact passages. Very advantageously, it is in this way possible for a contact location to be produced on the terminal contact and therefore a contact location which is electrically connected to the terminal contact can be produced on that side of the substrate material which is remote from the active surface, it being possible to dispense both with trenches which run along the substrate material and with a lateral contact which leads around the component in accordance with the prior art.
申请公布号 US2005042786(A1) 申请公布日期 2005.02.24
申请号 US20040947974 申请日期 2004.09.22
申请人 BIECK FLORIAN;LEIB JURGEN 发明人 BIECK FLORIAN;LEIB JURGEN
分类号 H01L23/52;H01L;H01L21/00;H01L21/3205;H01L21/44;H01L21/76;H01L21/768;H01L23/00;H01L23/12;H01L23/31;H01L23/485;H01L25/16;H01L27/146;H01L31/02;H01L31/0203;(IPC1-7):H01L21/00 主分类号 H01L23/52
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