| 摘要 |
A method for coating a wafer is provided to prevent ESD(Electro-Static Discharge) and residual stress by coating a surface of a wafer with a parylene. A preparation process is performed to prepare a masked wafer to mask one surface and a lateral surface of the wafer by using a mask, and to expose a coating part of the other surface of the wafer(S1). A parylene supply process is performed to input the masked wafer into a vacuum chamber and to supply a parylene to a heater connected with the vacuum chamber(S2). A gas forming process is performed to form a vacuum state within the vacuum chamber and to form a gas state of parylene by heating the parylene(S3). A coating process is performed to coat the wafer by supplying the gas state of parylene to the vacuum chamber(S4). A removing process is performed to remove the mask from the wafer(S5).
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