发明名称 |
COMPOSITIONS COMPRISING POLYIMIDE AND HYDROPHOBIC EPOXY, AND METHODS RELATING THERETO |
摘要 |
<p>Water absorption resistant polyimide/epoxy-based compositions, like pastes (or solutions), are particularly useful to make electronic screen-printable materials and electronic components. A group of hydrophobic epoxies (and soluble polyimides) was discovered to be particularly resistant to moisture absorption. The polyimide/epoxy pastes made with these epoxies (and these polyimides) may optionally contain thermal crosslinking agents, adhesion promoting agents, blocked isocyanates, and other inorganic fillers. The polyimide/epoxy pastes of the present invention can have a glass transition temperature greater than 250° C., a water absorption factor of less than 2%, and a positive solubility measurement.</p> |
申请公布号 |
EP1943311(A1) |
申请公布日期 |
2008.07.16 |
申请号 |
EP20060816800 |
申请日期 |
2006.10.12 |
申请人 |
E.I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
DUEBER, THOMAS, E.;SUMMERS, JOHN, D.;AUMAN, BRIAN, C.;SUBRAMANIAN, MUNIRPALLAM, A.;ROGADO, NYRISSA, S. |
分类号 |
C08L79/08;C08L63/00;H01B1/20;H01L23/29 |
主分类号 |
C08L79/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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