Embedded architecture using resin coated copper

摘要

Electronic assemblies and methods for their manufacture are described, including those related to the formation of an assembly including a carrier and a resin coated copper layer positioned on the carrier. The resin coated copper layer includes a first layer comprising a resin and a second layer comprising copper, with the first layer bonded to the second layer. The first layer of the resin coated copper is positioned between the carrier and the second layer of the resin coated copper. An opening is formed in the second layer of the resin coated copper. A die is positioned in the opening. A plurality of dielectric layers and metal pathways are positioned on the second layer and on the die. Other embodiments are described and claimed.

主权项

1. An assembly comprising:
a carrier structure; a resin coated copper layer positioned on the carrier structure, the resin coated copper layer including a first layer comprising a resin and a second layer comprising copper, the first layer bonded to the second layer, the first layer positioned between the carrier structure and the second layer; an opening extending through the second layer of the resin coated copper layer; a die positioned in the opening, the die positioned on the first layer comprising a resin, the die including a first surface and a second surface opposite the first surface, the first surface positioned between the carrier structure and the second surface, the first surface defining a total first surface area, wherein the first layer comprising a resin is positioned between the first surface and the carrier structure across the total first surface area and a plurality of dielectric layers and metal interconnections positioned on the second layer and on the die.