Method for directly attaching dielectric to circuit board with embedded electronic devices

摘要

A method for directly attaching dielectric to a circuit board with embedded electronic devices is provided. That is, a plurality of through holes are produced before embedding an electronic device, wherein plural through holes are corresponding to a plurality of electrodes of the electronic device. So that the plural electrodes of the electronic device is accurately positioned with the through holes if the electronic device is being embedded. On the other hand, since the first dielectric layer is adhesive, the electronic device is directly stuck on the first dielectric layer in order to save cost of adhesive material or metal conductive paste in prior arts.

主权项

1. A method for directly attaching dielectric to a circuit board with embedded electronic devices, comprising the steps of:
providing a copper clad laminate that comprises a copper layer; attaching a first dielectric layer to the copper clad laminate, wherein the first dielectric layer is adhesive; producing a plurality of through holes in the first dielectric layer and the copper clad laminate, the through holes corresponding to plural electrodes of at least one electronic device, wherein the electronic device pre-sets in the first dielectric layer; disposing the at least one electronic device on the first dielectric layer, so that the plural electrodes of the electronic device correspond to the through holes; continuously disposing a circuit substrate that accommodates a slot of the electronic device at two sides of the electronic device, so as to let the electronic device be accommodated in the slot, the circuit substrate having a second dielectric layer, a second circuit layer and a third circuit layer, wherein the second circuit layer is beneath the second dielectric layer and the third circuit layer is above the second dielectric layer; and overlapping a third dielectric layer and an additional circuit layer on the electronic device and the circuit substrate, wherein the additional circuit layer is beyond the third dielectric layer, and then laminating the third dielectric layer and the additional circuit layer on the electronic device and the circuit substrate, wherein the third dielectric layer has plasticity so as to fabricate a basic circuit board.