发明名称 Microphone device for reducing noise coupling effect
摘要 A microphone device includes a carrier board, a micro electro-mechanical system unit, an integrated circuit and an upper cover. The micro electro-mechanical system unit includes a substrate, a cap and a capacitive microphone. The cap is installed on the substrate, and is composed of electrically conductive material. The capacitive microphone is positioned between the cap and the carrier board, wherein the capacitive microphone and the cap form a resonant cavity. The integrated circuit is installed on the carrier board, and arranged to control the capacitive microphone. The upper cover is connected to the carrier board, wherein the micro-electro mechanical system unit and the integrated circuit are both positioned inside a space formed by the carrier board and the upper cover.
申请公布号 US9491531(B2) 申请公布日期 2016.11.08
申请号 US201414455949 申请日期 2014.08.11
申请人 3R SEMICONDUCTOR TECHNOLOGY INC. 发明人 Wang Chuan-Wei
分类号 H04R25/00;H04R1/04;H04R19/00;H04R19/04;B81B7/00 主分类号 H04R25/00
代理机构 代理人 Hsu Winston;Margo Scott
主权项 1. A microphone device, comprising: a carrier board; a micro electro-mechanical system (MEMS) unit, comprising: a substrate;a cap, installed on the substrate, and composed of electrically conductive material; anda capacitive microphone, positioned between the cap and the carrier board, wherein the capacitive microphone and the cap form a resonant cavity; an integrated circuit (IC), installed on the carrier board, and arranged to control the capacitive microphone; and an upper cover, connected to the carrier board, wherein the MEMS unit and the integrated circuit are both positioned inside a space formed by the carrier board and the upper cover; wherein the cap is directly installed on the capacitive microphone only, and there is no dielectric material between the cap and the capacitive microphone.
地址 Hsinchu TW