| 摘要 |
A ground structure using via-holes on a PCB(Printed Circuit Board) and a circuit device having the same are provided to enhance accuracy of a design by performing design in consideration of characteristic impedance. A ground structure(20) for a circuit device includes a signal transmission line(210), an upper ground unit(220), a lower ground unit(230), and a plurality of via holes(240). The signal transmission line is formed by patterning an upper metal layer. The upper ground unit is formed to be isolated from both lateral corners of the signal transmission line at a predetermined distance by patterning the upper metal layer. The lower ground unit is formed on a lower metal layer. The via holes connect the upper ground unit and the lower ground unit by passing through an insulating layer(200) and are filled with conductive material inside.
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