Connectors for an electrostatic chuck and combination thereof
摘要
A semiconductor wafer chuck for retaining a semiconductor wafer during semiconductor wafer processing in a semiconductor wafer processing system including a connector connecting DC chucking voltage and RF biasing power to an electrode embedded in the body of the chuck. The connector for the chuck includes two or more members joined by resilient banana connections. The connector may be adapted for use as a high temperature connector for an electrostatic chuck operated at an elevated temperature and such connector includes a thermal impedance for reducing the heat transferred from the chuck to the bottom of the connector.
申请公布号
US6151203(A)
申请公布日期
2000.11.21
申请号
US19980212000
申请日期
1998.12.14
申请人
APPLIED MATERIALS, INC.
发明人
SHAMOUILIAN, SHAMOUIL;KUMAR, ANANDA;KHOLODENKO, ARNOLD;GRIMARD, DENNIS S.;WANG, LIANG GUO;SCHNEIDER, GERHARD;CHAFIN, MICHAEL G.;KATS, SEMYON;VEYTSER, ALEXANDER;THACH, SENH