| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain an abrasive having a high grinding force without causing scratch in surface polishing of glass and flattening of a semiconductor substrate. SOLUTION: This abrasive comprises the following components (A) and (B): cerium-containing grinding abrasive grains having 0.5-5.0μm average grain diameter as the component (A) and at least one kind of grains selected from the group consisting of aluminum oxide, silicon dioxide, zirconium oxide, titanium oxide, silicon nitride and manganese oxide having 0.01-0.3μm average grain diameter as the component (B).</p> |
