| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad achieving more effective slurry flow patterns for achieving a large actual contact area with a workpiece and removing polishing waste, reducing the need of re-forming texture, providing a necessary rigidity structure for favorable planarization efficiency, and providing a large void capacity in a polishing layer adjoining a polishing surface. <P>SOLUTION: The polishing pad has the polishing layer 202 including an interpenetrating network including a non-fugitive phase 205 that is continuous and a fugitive phase 205 that is substantially co-continuous. The non-fugitive phase forms a three-dimensional network including a plurality of mutually connected polishing elements that define a mesh-like gap section, and the fugitive phase which is substantially co-continuous is disposed in the mesh-like gap section. <P>COPYRIGHT: (C)2009,JPO&INPIT |
