| 发明名称 | Package-on-Package with via on pad connections | ||
| 摘要 | An interposer includes a core dielectric material, a conductive pipe penetrating through the core dielectric material, and a metal pad underlying the conductive pipe. The metal pad includes a center portion overlapped by a region encircled by the conductive pipe, and an outer portion in contact with the conductive pipe. A dielectric layer is underlying the core dielectric material and the metal pad. A via is in the dielectric layer, wherein the via is in physical contact with the center portion of the metal pad. | ||
| 申请公布号 | US9460977(B2) | 申请公布日期 | 2016.10.04 |
| 申请号 | US201514968066 | 申请日期 | 2015.12.14 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Wu Jiun Yi |
| 分类号 | H01L23/48;H01L23/31;H01L25/065;H01L23/00;H01L25/10;H01L23/13;H01L21/683;H01L23/498;H01L21/56;H01L25/00 | 主分类号 | H01L23/48 |
| 代理机构 | Slater Matsil, LLP | 代理人 | Slater Matsil, LLP |
| 主权项 | 1. A structure comprising: a core dielectric material; a conductive pipe penetrating through the core dielectric material; a metal pad underlying the conductive pipe, wherein the metal pad comprises: a center portion overlapped by a region encircled by the conductive pipe; andan outer portion in contact with the conductive pipe; a dielectric layer underlying the core dielectric material and the metal pad; and a via in the dielectric layer, wherein the via is in physical contact with the center portion of the metal pad. | ||
| 地址 | Hsin-Chu TW | ||