发明名称 MANUFACTURING METHOD FOR PACKAGE AND PACKAGE MANUFACTURED BY THAT METHOD
摘要 PROBLEM TO BE SOLVED: To provide a method exhibiting a sufficient sealing effect while reducing the pressure applied to a substrate, in a manufacturing method for a sealing package using a metal powder sintered compact, formed of a metal paste, as a sealing material.SOLUTION: A manufacturing method for a package includes a step of hermetically sealing the interior of a sealing region surrounded by a sealing material, by superposing and bonding a pair of substrates where a sealing material is formed. In the invention, a sealing material formed of a sintered compact, produced by sintering one kind or more of metal powders, selected from gold, silver, palladium and platinum having a purity of 99.9 wt% or more and, and an average grain size of 0.005-1.0 μm, is used. On the substrate, at least one core material having a width narrower than the sealing material in the cross-sectional shape, and protruding from the surroundings is formed, so that when the pair of substrates are bonded, the core material compresses the sealing material and exhibits the sealing effect.SELECTED DRAWING: Figure 7
申请公布号 JP2016197664(A) 申请公布日期 2016.11.24
申请号 JP20150077160 申请日期 2015.04.03
申请人 TANAKA KIKINZOKU KOGYO KK 发明人 KOGASHIWA TOSHINORI;SASAKI YUYA;MIYAIRI MASAYUKI
分类号 H01L23/02;B81C3/00 主分类号 H01L23/02
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