| 摘要 |
<p>PURPOSE: To remarkably improve cutting accuracy by cutting a dicing tape or a dummy body and after that, performing the picture recognition of a dicing line to correct a dicing pattern set in advance and after that, positioning a cut plate. CONSTITUTION: A wafer and a dicing frame are simultaneously stuck on a dicing tape. The wafer is set to a dicing saw together with the frame and after the shape of the wafer is recognized, the alignment of a pattern is performed to start cutting. At that time, time cutting of a dicing tape 1 is started. After the dicing tape 1 is cut, the center of a dicing line is recognized by an optical system and when the displacement of an alignment center 4 is recognized, the displacement is corrected in a Y-axis direction and the dicing tape 1 is cut again. After that, the wafer is cut.</p> |
