INSULATING RING MEMBER AND SEMICONDUCTOR MANUFACTURING DEVICE PROVIDED THEREWITH

摘要

PURPOSE: To provide an insulating ring member which prevents the side face of a wafer from being processed by plasma so as to reduce foreign objects produced by plasma and to improve the wafer in yield when the wafer is processed with plasma and a semiconductor manufacturing device equipped therewith. CONSTITUTION: An insulating ring member 3 is used in a processing chamber where a wafer 1 is processed with plasma and possessed of an inner circumferential face 3a corresponding to the side face 1a of the wafer 1, wherein a gap (t) between the side face 1a of the wafer 1 and the inner circumferential face 3a of the ring member 3 is set smaller than 1mm when the wafer 1 is mounted on an electrostatic chuck 2 as a specimen pad.