| 摘要 |
PROBLEM TO BE SOLVED: To mirror finish the of a chamfered part and outer peripheral surface of a wafer with uniform machining surface pressure and to positively eliminate a grinding mark on the outer peripheral surface. SOLUTION: In a semiconductor wafer mirror finishing method for the chamfered part and outer peripheral surface of a semiconductor wafer chamfered at the angular part of the outer peripheral edge, by polishing drums 4, the chamfered part of the semiconductor wafer to be mirror finished is made to abut the polishing surface of one polishing drum 4 out of a pair of polishing drums 4 that can be elevated by a drum elevating driving means, and the outer peripheral surface of the semiconductor wafer is made to abut the polishing surface of the other polishing drum 4. As to at least the outer peripheral surface of the semiconductor wafer, the polishing drum 4 and the semiconductor wafer are rotated so that a speed vector based on the rotation of the polishing drum 4 and a speed vector based on the rotatory feed of the semiconductor wafer intersect each other, and the chamfered part and the outer peripheral surface are specularly machined individually and simultaneously by the respective polishing drums 4, so that a grinding mark and the like formed in a pre-process can be positively eliminated to improve mirror finished quality.
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