发明名称
摘要 PROBLEM TO BE SOLVED: To suppress influence of noise electromagnetically induced between transmission and reception sides of an optical link device. SOLUTION: An optical module Rx for reception is constituted by connecting a first molded resin section 40 molding a light receiving element to a second molded resin section 42 molding an electronic element through inner lead pins 28a-28d, which are bent in hook-like shapes projecting downward, and an optical module Tx for transmission is constituted by connecting a first molded resin section 68 molding a light emitting element to a second molded resin section 70 molding an electronic element through inner lead pins 56a and 56b, which are bent in hook-like shapes projecting upward. An optical link device is completed when the modules Rx and Tx are mounted on an alignment substrate 96 and the substrate 96 is incorporated in an enclosure. Since the lead pins 28a-28d and 56a and 56b are not faced oppositely to each other in the enclosure, the influence of electromagnetically induced noise can be suppressed.
申请公布号 JP3674019(B2) 申请公布日期 2005.07.20
申请号 JP19970357374 申请日期 1997.12.25
申请人 发明人
分类号 H01L23/50;G02B6/42;H02B1/00 主分类号 H01L23/50
代理机构 代理人
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