发明名称 |
Graded well implantation for asymmetric transistors having reduced gate electrode pitches |
摘要 |
In sophisticated semiconductor devices, an asymmetric transistor configuration may be obtained on the basis of an asymmetric well implantation while avoiding a tilted implantation process. For this purpose, a graded implantation mask may be formed, such as a graded resist mask, which may have a higher ion blocking capability at the drain side compared to the source side of the asymmetric transistor. For instance, the asymmetric configuration may be obtained on the basis of a non-tilted implantation process with a high degree of performance gain and may be accomplished irrespective of the technology standard under consideration. |
申请公布号 |
US9449826(B2) |
申请公布日期 |
2016.09.20 |
申请号 |
US201012692886 |
申请日期 |
2010.01.25 |
申请人 |
Advanced Micro Devices, Inc. |
发明人 |
Mulfinger G Robert;Wei Andy;Hoentschel Jan;Papageorgiou Vassilios |
分类号 |
H01L21/8234;H01L21/336;H01L21/266;H01L21/265;H01L29/66;H01L29/78 |
主分类号 |
H01L21/8234 |
代理机构 |
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代理人 |
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主权项 |
1. A method, comprising:
forming an implantation mask above a semiconductor region, said implantation mask having a first ion blocking capability above a first transistor internal area of a transistor and having a second ion blocking capability above a second transistor internal area of said transistor, said first and second ion blocking capabilities differing from each other, wherein the first transistor internal area is used for forming a source region and wherein the second transistor internal area is used for forming a drain region; implanting a well dopant species into said first and second transistor internal areas on the basis of said implantation mask; and forming a gate electrode above a channel area of said semiconductor region, said channel area laterally separating said first and second transistor internal areas. |
地址 |
Sunnyvale CA US |