Circuit board having bypass pad

摘要

An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.

主权项

1. A memory card comprising:
a printed circuit board (PCB) including:
a substrate;a plurality of external pads configured to be coupled to external devices;a plurality of bypass pads; anda solder resist layer covering the plurality of bypass pads; and a logic chip disposed on or above the substrate, wherein the PCB includes a first surface having a first edge and a second edge, the first edge being substantially perpendicular to the second edge, a length of the first edge being greater than a length of the second edge, the logic chip includes a second surface having a third edge and a fourth edge, the third edge being substantially perpendicular to the fourth edge, a length of the third edge being greater than a length of the fourth edge, and the third edge of the second surface of the logic chip is substantially parallel with the first edge of the first surface of the PCB, wherein the plurality of bypass pads are configured to test the logic chip, and wherein the plurality of bypass pads and external pads are electrically connected to the logic chip.