发明名称 Solution for etching copper during printed circuit board manufacture, includes copper ion source, acid, water, azole, aromatic compound and hydrogen peroxide
摘要 <p>The solution includes an ion source for copper(II), an acid and water. It contains an azole with nitrogen as heteroatoms in a ring, and at least one aromatic compound, selected from phenol compounds and aromatic amine compounds. Hydrogen peroxide is also included. The concentration of aromatic compound is in the range 0.01-20 g/l. The copper(II) ion source content is 14-155 g/l, based on the mass concentration of copper ions. 7-180 g/l of acid is contained, with 0.1-50 g/l of the azole. The azole is a tetrazole-based compound. The aromatic compound is a phenol. This comprises one or more compounds selected from phenol sulfonic acid and its salts, creosol sulfonic acid and its salts, salicylic acid and its salts, lignin sulfonic acid and its salts and 2, 4, 6-tris(dimehtylaminomethyl)phenol. The hydrogen peroxide concentration is in the range 0.01-20 g/l. To make a printed circuit board, the solution is used for masked (3) etching. Hydrogen peroxide is added to the solution, in order to keep the concentration of copper(I) ions generated in solution, to 5 g/l or less. The azole in the solution is kept at 0.1-50 g/l, during etching. A corresponding top-up solution is added during etching. An independent claim IS INCLUDED FOR the method of making a printed circuit board.</p>
申请公布号 DE102008045306(A1) 申请公布日期 2009.03.05
申请号 DE20081045306 申请日期 2008.09.02
申请人 MEC COMPANY LTD. 发明人 TODA, KENJI;TAKAGAKI, AI
分类号 C23F1/18;H05K3/06 主分类号 C23F1/18
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