| 发明名称 |
METHOD AND APPARATUS FOR INTERCONNECTING STACKED DIES USING METAL POSTS |
| 摘要 |
Embodiments include a semiconductor package comprising a first die having (i) a first side and (ii) a second side, wherein the first die comprises a first plurality of bond pads formed on the first side of the first die; a second die having (i) a first side and (ii) a second side, wherein the second die comprises a second plurality of bond pads formed on the first side of the second die, wherein the second die is stacked on the first die; a first plurality of metal posts formed on the first plurality of bond pads; a second plurality of metal posts formed on the second plurality of bond pads; and a redistribution layer configured to electrically couple (i) a first metal post of the first plurality of metal posts and (ii) a second metal post of the second plurality of metal posts. |
| 申请公布号 |
US2016247784(A1) |
申请公布日期 |
2016.08.25 |
| 申请号 |
US201615047426 |
申请日期 |
2016.02.18 |
| 申请人 |
Marvell World Trade Ltd. |
发明人 |
Wang Long-Ching |
| 分类号 |
H01L25/065;H01L25/00 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package comprising:
a first die having (i) a first side and (ii) a second side disposed opposite the first side of the first die, wherein the first die comprises a first plurality of bond pads formed on the first side of the first die; a second die having (i) a first side and (ii) a second side disposed opposite the first side of the second die, wherein the second die comprises a second plurality of bond pads formed on the first side of the second die, wherein the second die is stacked on the first die such that the second side of the second die is attached to the first side of the first die; a first plurality of metal posts, wherein each of the first plurality of metal posts is formed on a corresponding one of the first plurality of bond pads formed on the first side of the first die; a second plurality of metal posts, wherein each of the second plurality of metal posts is formed on a corresponding one of the second plurality of bond pads formed on the first side of the second die; and a redistribution layer configured to electrically couple (i) a first metal post of the first plurality of metal posts and (ii) a second metal post of the second plurality of metal posts. |
| 地址 |
St. Michael BB |
