发明名称 | Accelerated relaxation of strain-relaxed epitaxial buffers by use of integrated or stand-alone thermal processing | ||
摘要 | Implementations of the present disclosure generally relate to methods and apparatus for forming a film on a substrate. More particularly, implementations of the present disclosure relate to methods and apparatus for heteroepitaxial growth of crystalline films. In one implementation, a method of heteroepitaxial deposition of a strain relaxed buffer (SRB) layer on a substrate is provided. The method comprises epitaxially depositing a buffer layer over a dissimilar substrate, rapidly heating the buffer layer to relax the buffer layer, rapidly cooling the buffer layer and determining whether the buffer layer has achieved a desired thickness. | ||
申请公布号 | US9443728(B2) | 申请公布日期 | 2016.09.13 |
申请号 | US201414461191 | 申请日期 | 2014.08.15 |
申请人 | APPLIED MATERIALS, INC. | 发明人 | Srinivasan Swaminathan T.;Noori Atif M.;Carlson David K. |
分类号 | H01L21/02;H01L21/67;H01L21/324 | 主分类号 | H01L21/02 |
代理机构 | Patterson & Sheridan, LLP | 代理人 | Patterson & Sheridan, LLP |
主权项 | 1. A method of heteroepitaxial deposition of a strain relaxed buffer (SRB) layer on a substrate, comprising: epitaxially depositing a buffer layer over a dissimilar substrate; rapidly heating the buffer layer by exposing the buffer layer to a pulsed laser annealing process to relax the buffer layer; rapidly cooling the buffer layer; and determining whether the buffer layer has achieved a desired thickness, wherein the buffer layer is a material selected from the group consisting of: GaN, AlN, AlGaN, InGaN, InAlGaN, GaAs, InAlAs, Si, Ge, C, Sn, SiGe, SiC, GaSb, AlSb, GaP, AlP, InP, InSb, ZnO, WSe2, MoSe2 and combinations thereof. | ||
地址 | Santa Clara CA US |