| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printing paste for absorbing an electrode bump, which is used for manufacturing a laminated ceramic electronic component, able to sheet attack effectively even when the thickness of a ceramic green sheet is thinned, and able to form a margin pattern layer, having high air permeability, while holding viscosity suitable for printing. <P>SOLUTION: The printing paste for absorbing an electrode bump, used for manufacturing the laminated ceramic electronic component is used by combining with the ceramic green sheet containing butyral resin, contains at least ceramic powder, an organic binder, a solvent, wherein the content of the binder is 1.0-6.0 parts by weight with respect to 100 parts by weight of the ceramic powder, the organic binder contains ethyl cellulose and polyvinyl butyral, and the solvent contains at least one kind selected from glycerol, ethylene glycol, and butyl carbitol. <P>COPYRIGHT: (C)2009,JPO&INPIT |
