| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a planar shape which can minimize a portion of a semiconductor wafer to be discarded when a plurality of semiconductor chips having the same planar shape are formed from a semiconductor wafer and lessen the impact of thermal stress, which occurs in the semiconductor chip.SOLUTION: A plurality of semiconductor chips 11 are divided from a semiconductor wafer 20 to have the same planar shape and the planar shape of each semiconductor chip 11 has six connection parts 17 for connecting straight lines 15, 16 adjacent to each other so as to have an obtuse angled interior angle formed by the one straight line 15 and the other straight line 16 adjacent to the one straight line 15. All of the six connection parts 17 have R shapes. Because of this, when the semiconductor wafer 20 is divided into chips, a portion of the semiconductor wafer 20 to be discarded can be minimized. The R shape of the connection part 17 can lessen the impact of thermal stress, which is exerted on the semiconductor chip 11.SELECTED DRAWING: Figure 1 |
