发明名称 BALL FORMING DEVICE FOR WIRE BONDER
摘要 [Problem] To provide a ball forming device for a wire bonder in which a discharge voltage value during a ball forming step can be freely changed. [Solution] A first current control circuit 4 for controlling a discharge current is arranged between a tip section of a wire 31 and one electrode of a discharge continuing power source 3 for applying a discharge current after a dielectric breakdown, a second current control circuit 10 is arranged for controlling shunting of the discharge current between a discharge electrode and the other electrode of the discharge continuing power source 3, and a fixed resistor 11 is connected in parallel as a shunt to the second current control circuit 10 and controls the current flowing through the second current control circuit 10, thereby freely changing the discharge voltage value. Consequently, the discharge voltage value can be maintained in a constant state even if the discharge state changes, and an initial ball can be stably formed.
申请公布号 WO2016178285(A1) 申请公布日期 2016.11.10
申请号 WO2015JP63152 申请日期 2015.05.03
申请人 KAIJO CORPORATION 发明人 SAKURAI Yusuke
分类号 H01L21/60 主分类号 H01L21/60
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