发明名称 Layered thin film heater and method of fabrication
摘要 A method of forming thin film heater traces on a wafer chuck includes positioning a pattern, that forms openings corresponding to a desired layout of the heater traces, in proximity to the wafer chuck. The method includes sputtering a material toward the pattern and the wafer chuck such that a portion of the material passes through the openings and adheres to the wafer chuck to form the heater traces. A method of forming thin film heater traces on a wafer chuck includes sputtering a blanket layer of a material onto the wafer chuck, and patterning a photoresist layer utilizing photolithography. The photoresist layer covers the blanket layer in an intended layout of the heater traces, exposing the blanket layer in areas that are not part of the intended layout. The method removes the areas that are not part of the intended layout by etching, and removes the photoresist layer.
申请公布号 US9499898(B2) 申请公布日期 2016.11.22
申请号 US201414195402 申请日期 2014.03.03
申请人 Applied Materials, Inc. 发明人 Nguyen Son T.;Lubomirsky Dmitry
分类号 H05B3/68;C23C14/04;H01L21/67;H01L21/687;C23C14/18 主分类号 H05B3/68
代理机构 Kilpatrick Townsend & Stockton LLP 代理人 Kilpatrick Townsend & Stockton LLP
主权项 1. A method of forming thin film heater traces on a wafer chuck, comprising: positioning a pattern in proximity to the wafer chuck, the pattern forming openings corresponding to a desired layout of the thin film heater traces, and sputtering a material toward the pattern and the wafer chuck such that a portion of the material passes through the openings and adheres to the wafer chuck to form the thin film heater traces; wherein: the wafer chuck comprises ceramic, and the ceramic forms vacuum channels configured to secure a wafer against the wafer chuck in proximity to the thin film heater traces.
地址 Santa Clara CA US