| 发明名称 |
Adhesive Agent Composition and Adhesive Film For Electronic Component |
| 摘要 |
An adhesive agent composition for bonding an electronic component contains a polyester unsaturated compound having a number average molecular weight of 2,000-6,000. The electronic component is bonded by using a film produced by forming the composition into a film.
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| 申请公布号 |
US2008230749(A1) |
申请公布日期 |
2008.09.25 |
| 申请号 |
US20050569265 |
申请日期 |
2005.05.19 |
| 申请人 |
BRIDGESTONE CORPORATION |
发明人 |
MATSUSE TAKAHIRO;HANZAWA KENTARO |
| 分类号 |
C08G63/66;C08F299/04;C08K3/00;C08K5/14;C08K5/1515;C08K5/5419;C08K5/5435;C08L63/00;C08L93/04;C09J7/00;C09J9/02;C09J129/14;C09J167/06;C09J167/07;H01R11/01;H05K3/30;H05K3/32;H05K3/34 |
主分类号 |
C08G63/66 |
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