| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate cutting device improving productivity. <P>SOLUTION: The substrate cutting device is provided with two chuck tables 2 and 2 for holding a substrate 1 by sucking in upright position with respective to a horizontal plane. A cut position to cut the substrate held by sucking on these chuck tables 2, and a delivery position for loading the substrate onto the chuck tables 2 and/or unloading of individual pieces are disposed axially in a vertical direction apart from each other by a predetermined distance. These two chuck tables 2 and 2 are annexed to rotation means 4. These chuck tables 2 and 2 are integrally movable to the cut position and the delivery position by rotating the rotation means 4 axially in the vertical direction. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
