发明名称 |
Defect-free relaxed covering layer on semiconductor substrate with lattice mismatch |
摘要 |
A defect-free, relaxed semiconductor covering layer (e.g., epitaxial SiGe) over a semiconductor substrate (e.g., Si) is provided having a strain relaxation degree above about 80% and a non-zero threading dislocation density of less than about 100/cm2. A lattice mismatch exists between the substrate and the covering layer. The covering layer also has a non-zero thickness that may be less than about 0.5 microns. The strain relaxation degree and threading dislocation are achieved by exposing defects at or near a surface of an initial semiconductor layer on the substrate (i.e., exposing defects via selective etch and filling-in any voids created), planarizing the filled-in surface, and creating the covering layer (e.g., growing epitaxy) on the planarized, filled-in surface, which is also planarized. |
申请公布号 |
US9368342(B2) |
申请公布日期 |
2016.06.14 |
申请号 |
US201414252447 |
申请日期 |
2014.04.14 |
申请人 |
GLOBALFOUNDRIES INC. |
发明人 |
Huang Haigou;Liu Huang;Liu Jin Ping |
分类号 |
H01L21/02;H01L21/311;H01L21/306 |
主分类号 |
H01L21/02 |
代理机构 |
Heslin Rothenberg Farley & Mesiti P.C. |
代理人 |
Reinke, Esq. Wayne F.;Heslin Rothenberg Farley & Mesiti P.C. |
主权项 |
1. A semiconductor structure, comprising:
a semiconductor substrate, comprising at least one first semiconductor material; a second layer of at least one second semiconductor material on the substrate; and a semiconductor covering layer on the second layer; wherein a lattice mismatch exists between the substrate and the covering layer, wherein at a boundary between the second layer and the semiconductor covering layer is at least one filled indent, the at least one filled indent being filled with filler material; and wherein the covering layer has a strain relaxation degree above about 80% and a non-zero threading dislocation density of less than about 100/cm2. |
地址 |
Grand Cayman KY |