| 摘要 |
PROBLEM TO BE SOLVED: To achieve an electronic device that can suppress a load at the time when electrodes of electronic components are directly bonded with each other and that is excellent in bonding reliability.SOLUTION: Firstly, an outer face 111 of an electrode 110 for which a metal is used, of an electronic component 100, and an outer face 211 of an electrode 210 for which a metal is used, of an electronic component 200 are contacted with each other. For example, on both the outer face 111 and the outer face 211 to be contacted with each other, a branch-like oxide 112 and an oxide 212 of the respective metals used for the electrode 110 and the electrode 210 are provided, respectively. In such a state where the outer face 211 and the outer face 111 are contacted with each other, reduction of the branch-like oxide 112 and the oxide 212 and application of load are performed to directly bond the electrode 110 and the electrode 210 with each other by solid-phase diffusion bonding.SELECTED DRAWING: Figure 5 |
