ENCAPSULATED DIES WITH ENHANCED THERMAL PERFORMANCE

摘要

The present disclosure relates to a semiconductor package having encapsulated dies with enhanced thermal performance. The semiconductor package includes a carrier, an etched flip chip die attached to a top surface of the carrier, a first mold compound, and a second mold compound. The etched flip chip die includes a device layer and essentially does not include a substrate. The first mold compound resides on the top surface of the carrier, surrounds the etched flip chip die, and extends beyond a top surface of the etched flip chip die to form a cavity, to which the top surface of the etched flip chip die is exposed. The second mold compound fills the cavity and is in contact with the top surface of the etched flip chip die. The second mold compound having a high thermal conductivity improves thermal performance of the etched flip chip die.

主权项

1. An apparatus comprising:
a carrier having a top surface; an etched flip chip die comprising a device layer attached to the top surface of the carrier, wherein at least a portion of a substrate of the etched flip chip die has been removed from the etched flip-chip die; a first mold compound residing on the top surface of the carrier, surrounding the etched flip chip die, and extending beyond a top surface of the etched flip chip die to form a cavity within the first mold compound, wherein the top surface of the etched flip chip die is exposed at a bottom of the cavity; and a second mold compound filling the cavity and in contact with the top surface of the etched flip chip die.