MOUNTING APPARATUS AND METHOD OF CORRECTING OFFSET AMOUNT OF THE SAME

摘要

A method, which includes: a first chip-position calculation step of taking an image of an upper surface of a reference chip and an image of a lower surface of a correction chip to calculate positions of the chips; a second chip-movement step of moving the reference chip to a position, based on a displacement amount between the chips that has been calculated based on the positions of the chips, at which a distance between the chips corresponds to a predetermined offset amount, and then placing the correction chip on the suction stage; a second chip-position calculation step of taking an image of an upper surface of the correction chip, and calculating a second position of the correction chip; and a correction amount calculation step of calculating a correction amount of the predetermined offset amount based on the position of the reference chip and the second position of the correction chip.

主权项

1. A mounting apparatus comprising:
a mounting stage; a reference chip and a correction chip that are placed on the mounting stage; an upper/lower dual-view camera configured to take an upper image and a lower image at the same time; and a control unit configured to move positions of the reference chip and the correction chip, and to process the images taken by the upper/lower dual-view camera.