COLD TRANSFER DEVICE AND SEMICONDUCTOR REFRIGERATION BOX HAVING COLD TRANSFER DEVICE

摘要

Provided are a cold transfer device and a semiconductor refrigeration box having the cold transfer device. The cold transfer device (32) comprises one or more heat pipes (322) and an upper fin set (323). The heat pipe (322) has an upper section and a lower section. The upper section is configured to be in a direct or indirect thermal connection with a cold source so as to absorb and transfer cold of the cold source to the lower section of the heat pipe (322). The upper fin set (323) is in a direct or indirect thermal connection with the upper section of the heat pipe (322).