ELECTRONIC COMPONENT, ELECTRONIC MODULE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To reduce in size of an electronic component.SOLUTION: An electronic component comprises: an electronic device; a mounting member that mounts the electronic device and includes a first connecting part electrically connected to the electronic device and a second connecting part electrically connected to an outer part; and a sealing member that covers the electronic device and the first connecting part. The mounting member includes: a substrate that has a loading surface onto which the electronic device is loaded; a first conducting layer that is arranged onto the loading surface; and a second conducting layer that is arranged away from the first conducting layer in a first direction intersecting the loading surface. The first conducting layer includes: a first conducting pattern that has the first connecting part; and a second conducting pattern that is arranged away from the first conducting pattern in a second direction along with the loading surface, and has the second connecting part. The second conducting pattern is connected to the first conducting pattern through a third conducting pattern including the second conducting layer, and the sealing member does not cover the second conducting pattern.SELECTED DRAWING: Figure 1