| 发明名称 |
Method for Handling a Product Substrate, a Bonded Substrate System and a Temporary Adhesive |
| 摘要 |
A method for handling a product substrate includes bonding a carrier to the product substrate. A layer of a permanent adhesive is applied onto a surface of the carrier. A structured intermediate layer is provided. The applied permanent adhesive bonds the carrier to the product substrate. The structured intermediate layer is arranged between the product substrate and the carrier. A surface of the structured intermediate layer and a surface of the permanent adhesive are in direct contact to a surface of the product substrate. The structured intermediate layer decreases a bonding strength between the product substrate and the carrier. |
| 申请公布号 |
US2016218039(A1) |
申请公布日期 |
2016.07.28 |
| 申请号 |
US201615002009 |
申请日期 |
2016.01.20 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Meyer-Berg Georg;von Waechter Claus;Bauer Michael;Doepke Holger;Maier Dominic;Porwol Daniel;Schmidt Tobias |
| 分类号 |
H01L21/78;H05K3/00;H01L21/683 |
主分类号 |
H01L21/78 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for handling a product substrate, the method comprising:
bonding a carrier to the product substrate by:
applying a layer of a permanent adhesive onto a surface of the carrier;providing a structured intermediate layer; andbonding the carrier to the product substrate using the applied permanent adhesive, wherein the structured intermediate layer is arranged between the product substrate and the carrier, wherein a surface of the structured intermediate layer and a surface of the permanent adhesive are in direct contact to a surface of the product substrate, wherein the structured intermediate layer decreases a bonding strength between the product substrate and the carrier. |
| 地址 |
Neubiberg DE |
