| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board laminate that enables the continuity inspection to be performed before a semiconductor chip is mounted, a semiconductor device using the same, and a method of manufacturing the semiconductor device.SOLUTION: A wiring board laminate comprises a supporting body, an adhesive agent layer, a high-resistance conductive layer, and a wiring board. The wiring board has: a conductive layer; two or more resin layers; a first wiring pattern and a second wiring pattern that are provided between the two or more resin layers and separated from each other; a first connection terminal connected with the first wiring pattern; a second connection terminal connected with the second wiring pattern; a first connection pad provided above the conductive layer and connected with the first wiring pattern; and a second connection pad connected with the second wiring pattern. A resistance value rbetween the first connection terminal and the first connection pad, a resistance value rbetween the second connection terminal and the second connection pad, and a resistance value R between the first connection pad and the second connection pad, satisfy r<R, and r<R, and R<10000 Ω.SELECTED DRAWING: Figure 2 |
