发明名称 VERFAHREN UND VORRICHTUNG ZUR HERSTELLUNG ELEKTRISCH LEITFÄHIGER DURCHGÄNGE IN HALBLEITER- BAUELEMENTEN
摘要 The invention relates to a process and a device for the production of electrically conductive passages in semiconductor components preferably positioned on a semiconductor, by means of thermo-migration through the production of a temperature gradient between two opposing outer surfaces of the semiconductor components and application of a conductive doping substance to a cooler outer surface. One outer surface of the semiconductor is positioned on a cooled sample take-up and the opposing outer surface is exposed to heat radiation, which can be controlled both with regard to its total efficiency and its efficiency distribution over the surface of the semiconductor. The total efficiency and/or the efficiency distribution of the heat radiation is adjusted depending upon the temperature measured on at least one temperature measurement point on the semiconductor and/or a semiconductor component.
申请公布号 AT221146(T) 申请公布日期 2002.08.15
申请号 AT19980943631T 申请日期 1998.06.22
申请人 DR. JOHANNES HEIDENHAIN GMBH;SILICON SENSOR GMBH 发明人 KRIEGEL, BERND;KUDELLA, FRANK;ARNOLD, RENE
分类号 H01L23/52;H01L21/00;H01L21/22;H01L21/225;H01L21/3205;H01L21/768;H01L31/02;H01L31/10;(IPC1-7):C30B13/02;H01L31/022;H01L21/24;H01L23/48 主分类号 H01L23/52
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