| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhering method in which workability is superior, cost reduction can be realized, and exact adhesion can be attained. SOLUTION: An adhesive sheet 20 is punched by a press machine 30 in an adhesion size and adhered to a carrier film 10. Then, a positioning pin 14 is put through the positioning hole of the carrier film 10, the carrier film 10 to which the adhesive sheet 20 is adhered is carried to an adhering device 31 on which a substrate 40 is placed, and the adhesive sheet 20 is pressed from the side of the carrier film 10 by using a metallic mold 32, and transferred to the substrate 40. Afterwards, a semiconductor chip 50 is placed on the adhesive sheet 20 transferred on the substrate 40 and adhered to the adhesive sheet 20 while heating and pressing.
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