An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.
申请公布号
WO2005017229(A1)
申请公布日期
2005.02.24
申请号
WO2003US29382
申请日期
2003.09.18
申请人
ENTHONE INC.;OWEI, ABAYOMI, I.;NGUYEN, HIEP, X.;YAKOBSON, ERIC