发明名称 ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS
摘要 An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.
申请公布号 WO2005017229(A1) 申请公布日期 2005.02.24
申请号 WO2003US29382 申请日期 2003.09.18
申请人 ENTHONE INC.;OWEI, ABAYOMI, I.;NGUYEN, HIEP, X.;YAKOBSON, ERIC 发明人 OWEI, ABAYOMI, I.;NGUYEN, HIEP, X.;YAKOBSON, ERIC
分类号 C23C22/52;C23C28/00;C23F1/18;H05K3/38 主分类号 C23C22/52
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