Semiconductor device and method of manufacturing same

摘要

The semiconductor device ( 10 ) comprises a carrier ( 30 ) and a semiconductor element ( 20 ), such as an integrated circuit. The carrier ( 30 ) is provided with apertures ( 15 ), thereby defining connecting conductors ( 31 - 33 ) having side faces ( 3 ). Notches ( 16 ) are present in the side faces ( 3 ). The semiconductor element ( 20 ) is enclosed in an encapsulation ( 40 ) that extends into the notches ( 16 ) in the carrier ( 30 ). As a result, the encapsulation ( 40 ) is mechanically anchored in the carrier ( 30 ). The semiconductor device ( 10 ) can be made in a process wherein, after the encapsulating step, no lithographic steps are necessary.